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Qualitek Lead Free Supplier
Qualitek understands that implementation of
Lead-Free processes can be complex and is
prepared to help customers overcome the
unique challenges that may arise. Qualitek
offers an advanced solution for Lead-Free
applications, which include
No-Clean and Water-Soluble cored wire, liquid
fluxes, and paste.
Lead Free Solder Composition
Several Lead-Free solders have been speci-
fied as alternatives for sn/pb alloys used in
electronics assembly operations. Qualitek
manufactures these alloys to exceed the impu-
rity requirements of J-STD-006 and all other
relevant international standards.
Lead Free Cored Solder Wire
Qualitek has developed a unique flux system
designed specifically for high temperature
Lead-Free alloys. It provides the fluxing activi-
ty levels that promote fast wetting action and
maximum wetting spread.
Physical Property Alloy Analysis
SnAgCu
Sn/Ag/Cu
(96.5/3.0/0.5)
Melting point, °C
217-221°C
Hardness, Brinell
15HB
Tensile strength, psi
4312
Density, g / cc
7.39
Coefficient of
Thermal Expansion
Pure Sn=23.5
Electrical Resistivity
(µohm - cm)
13.0
Electrical Conductivity,
% IACS
16.6
Wire Solder
Wire Formula Residue Removal By
Flux Class per
J-STD-004
NC600
No-Clean
Not required. If Desired,
Solvent/Semi Aqueous
REL0
NC601
No-Clean
Not required.
If Desired, Hot water
ORL0
NC609
No-Clean
Colophony free
Not required.
If Desired, Hot water
REL0
WS700
Water-Soluble
Hot DI Water
ORH1
RMA200
Rosin Mildly acivated
Solvent/Semi-Aqueous
ROL1
RA 300
Activated Rosin
Solvent/Semi-Aqueous
ROL1
SRA 500
Rosin Super Activated
Solvent/Semi-Aqueous
ROM1
Solid Wire
No Flux Core
NA
NA
Standard Core wire Solder
Formulations:
NC
600
WS
700
RA 300
Test Method
Type
No-Clean
Wire Core
Water-Soluble
Wire Core
Rosin Core
Flux classification:
REL0
ORH1
JSTD-004
Copper Mirror
No removal
Complete
removal
IPC-TM-650 2.3.32
Silver Chromate
Pass
Fail
IPC-TM-650 2.3.33
Corrosion
SIR
Pass
Pass
(cleaned coupons)
IPC-TM-650 2.6.15
JSTD-004,
2.33X10
11
ohms
1.49X10
10
ohms
(cleaned)
IPC-TM-650 2.6.3.3
Bellcore (Telecordia) 6.12X10
11
ohms
4.12X10
11
ohms
(cleaned)
Bellcore GR-
78-CORE 13.1.3
Electromigration
Pass
Pass
(cleaned)
Bellcore GR-
78-CORE 13.1.4
Post Reflow
Flux Residue
55%
65%
TGA Analysis
Acid Value
190-210
120-130
IPC-TM-650 2.3.13
Flux Residue
Dryness
Pass
Pass
IPC-TM-650 2.4.47
Spitting of Flux
Cored Solder
0.3%
0.4%
IPC-TM-650 2.4.48
Solder Spread
>130mm
2
>130mm
2
IPC-TM-650 2.4.46
Standard Wire Diameters
Diameter (inch)
0.125
0.092
0.062
0.050
0.040
0.032
0.025
0.020
0.015 0.010
Diameter (mm)
3.18
2.33
1.57
1.27
1.01
0.81
0.63
0.50
0.38
0.25
Std. Wire Gauge
11
13
16
18
19
21
23
25
28
31
Flux Core Wire Solder
OFC...,243,244,245,246,247,248,249,250,251,252 254,255,256,257,258,259,260,261,262,263,...352